Determining Additional Modulus of Subgarde Reaction Based on Tolerable Settlement for the Nailed-slab System Resting on Soft Clay

Puri, Anas and Hardiyatmo, Hary Christady and Suhendro, Bambang and Rifa’i, Ahmad (2012) Determining Additional Modulus of Subgarde Reaction Based on Tolerable Settlement for the Nailed-slab System Resting on Soft Clay. International Journal of Civil & Environmental Engineering IJCEE-IJENS, 12 (03). pp. 32-44. ISSN 2227-2763

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Abstract

Nailed-slab System is a proposed alternative solution for rigid pavement problem on soft soils. Equivalent modulus of subgrade reaction (k’) can be used in designing of nailed-slab system. This modular is the cumulative of modulus of subgrade reaction from plate load test (k) and additional modulus of subgrade reaction due to pile installing (∆∆∆∆k). A recent method has used reduction of pile resistance approach in determining ∆∆∆∆k. The relative displacement between pile and soils, and reduction of pile resistance has been identified. In fact, determining of reduction of pile resistance is difficult. This paper proposes an approach by considering tolerable settlement of rigidpavement. Validation is carried out with respect to a loading test of nailed-slab models. The models are presented as strip section of rigid pavement. The theory of beams on elastic foundation is used to calculate the slab deflection by using k’. Proposed approach can results in deflection prediction close to observed one. In practice, the Nailed-slab System would be constructed by multiple-row piles. Designing this system based on one-pile row analysis will give more safety design and will consume less time.

Item Type: Article
Uncontrolled Keywords: soft clay, Nailed-slab System, friction pile, tolerable settlement, modulus of subgrade reaction.
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Divisions: > Teknik Sipil
> Teknik Sipil
Depositing User: Mia
Date Deposited: 03 Jun 2021 05:40
Last Modified: 03 Jun 2021 05:40
URI: http://repository.uir.ac.id/id/eprint/2585

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