Sistem Sapaan Bahasa Melayu Riau Dialek Kampung Rempak Kecamatan Sabak Auh Kabupaten Siak

Dewi, Asnita (2021) Sistem Sapaan Bahasa Melayu Riau Dialek Kampung Rempak Kecamatan Sabak Auh Kabupaten Siak. Other thesis, Universitas Islam Riau.

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Abstract

The Riau Malay Greeting System Dialect of Kampung Rempak, Sabak Auh District, Siak Regency. Every individual or member of the community will not be separated from interaction with each other, because greeting and greeting is an absolute thing to do in everyday life. In human interaction can not be separated from language. Language is a medium for conveying messages or information from one individual to another or more individuals, both orally and in writing. The problems in this study are: (1) What are the kinship systems of the Riau Malay language dialect of Kampung Rempak, Sabak Auh District, Siak Regency? (2) What are the non-kinship greeting systems in the Malay dialect of Kampung Rempak, Sabak Auh District, Siak Regency? The purpose of this study is to describe, analyze and interpret the kinship and non-kinship greeting system in Malay in Kampung Rempak, Sabak Auh District, Siak Regency. This study uses the ethnographic method. field observations. In conducting ethnographic research, the researcher focuses his research on a society. Data collection techniques using observation, documentation, recording and interview techniques. The research approach uses a qualitative approach, and the results of the study show that the Riau Malay dialect of the Kampung Rempak dialect of Sabak Auh greeting system to fellow relatives, namely there are 22 greetings. While the non-kinship greeting system has 16 greetings.

Item Type: Thesis (Other)
Contributors:
ContributionContributorsNIDN/NIDK
SponsorNazirun, Nazirun0022115506
Uncontrolled Keywords: Malay language, kinship and non-kinship greetings
Subjects: L Education > L Education (General)
Divisions: > Pendidikan Bahasa Indonesia
Depositing User: Febby Amelia
Date Deposited: 16 Jun 2022 04:50
Last Modified: 16 Jun 2022 04:50
URI: http://repository.uir.ac.id/id/eprint/11436

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